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魏伟; 陈志忠; 郭浩中; 贾传宇; 方方; 邹军; 房倩; 吴优; 孙铭浩; 李倩; 匡宇涵; 殷琦凯; 张国义

doi:10.37188/CO.EN-2023-0017

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魏伟 ^1,,
陈志忠 ⁴,
郭浩中 ^{6, 7},
贾传宇 ²,
方方 ³,
邹军 ⁸,
房倩 ¹,
吴优 ¹,
孙铭浩 ¹,
李倩 ¹,
匡宇涵 ¹,
殷琦凯 ¹,
张国义 ⁵

1.
江苏省智能光电器件与测控工程研究中心, 盐城师范学院, 盐城市, 江苏省 224007, 中国
2.
东莞理工学院国际微电子学院, 中国, 东莞, 广东省 523000, 中国
3.
金鉴科技有限公司, 广州市, 广东省 511338, 中国
4.
北京大学物理学院, 海淀区, 北京市 100091, 中国
5.
北京大学东莞光电研究院, 东莞, 广东 523808, 中国
6.
光电工程学系, 国立阳明大学, 新竹市, 台湾省 30010, 中国
7.
半导体所, 鸿海研究院, 新北市, 台湾省 236, 中国
8.
上海应用技术大学, 上海市 201418, 中国

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- 网络出版日期: 2023-10-18

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doi: 10.37188/CO.EN-2023-0017

WEI Wei ^{1
,},
CHEN Zhi-zhong ⁴,
KUO Hao-chung ^{6, 7},
JIA Chuan-yu ²,
FANG Fang ³,
ZOU Jun ⁸,
FANG Qian ¹,
WU You ¹,
SUN Ming-hao ¹,
LI Qian ¹,
KUANG Yu-han ¹,
YIN Qi-kai ¹,
ZHANG Guo-yi ⁵

1.
Jiangsu Intelligent Optoelectronic Device and Measurement and Control Engineering Research Center, Yancheng Teachers University, Yancheng City, Jiangsu Province 224007, China
2.
School of International Academy of Microelectronics Dongguan University of Technology Guangdong, Dongguan 523000, China
3.
Gold Medal Analysis, 2 Xiangshan Road, Zengcheng District, Guangzhou 511338, China
4.
College of Physics, Peking University, Haidian District, Beijing 100091, China
5.
Department, Dongguan Institute of optoelectronics, Peking University, Dongguan, Guangdong 523808, China
6.
Department of Photonics and Institute of Electro-optic Engineering, National Yang-Ming Chiao-Tung University, Hsinchu 30010, Taiwan, China
7.
Semiconductor Research Center, Hon Hai Research Institute, New Taipei City 236, Taiwan, China
8.
Shanghai Institute of Technology, Shanghai 201418, China

Funds:Supported by This study was supported by the following projects: “Dr. Shuangchuang” in the Jiangsu Province in 2021, project number JSSCBS20211145, “Research on New Micro-LED Chips for High Optoelectronic Properties,” and the 2022 open project “Research on Pulsed Dimmable LED Plant Lighting Fixtures” funded by the Jiangsu Intelligent Optoelectronic Device and Measurement and Control Engineering Research Center.

More Information

Author Bio:
WEI Wei, male, Ph.D., lecturer at Yancheng Teachers University, mainly engaged in micro-LED device lighting design. E-mail: [email protected]

摘要

摘要:
本研究分析了目前用于显示器的高均匀宽角度灯珠的光学要求。采用新型非朗伯（non-Lambertian）分布封装Micro-LED芯片，实现了宽光束、高均匀性的微型LED芯片光珠。本文分析了在不同封装倾角、封装高度、封装材料、封装支架材料、蓝宝石厚度和图案化蓝宝石衬底尺寸下，使用由不同封装材料（铜、钛、铝和银）和材料类型（完全反射和完全吸收）组成的支架，模拟了固定灯珠的光输出效率和出光角度的变化。通过调整材料、芯片和封装参数，本文看可以得到一个、两个或三个光束，具有贴片灯珠的宽角度、高均匀性的远场光分布特性，可以满足当前LED和LCD的显示要求。
- 非朗伯分布 /
- 朗伯分布 /
- 显示 /
- 贴片灯珠
Abstract:
This study analyses the optical requirements of wide beam and high uniformity light beads, which are currently used in displays. Packaging micro light-emitting diode (LED) chips with a novel non-Lambertian distribution has facilitated the production of micro-LED chip light beads that are wide in beam and high in uniformity. The light output efficiency and beam angle of fixed beads were simulated using brackets made of copper, titanium, aluminium and silver, as well as materials that were completely reflecting and absorbing. The simulations were conducted at various fixture angles, packaging heights, sapphire thicknesses, and patterned sapphire substrate sizes. By adjusting the chip and packaging parameters, we can obtain one, two, or three light beams with SMD lamp beads characteristics that provide wide angles, high uniformity, and far-field light distribution. These characteristics can meet the current display requirements for LED and LCD.
- non-lambertian distribution /
- lambertian distribution /
- displays /
- SMD lamp beads

HTML全文

Figure 1. Top view of the LED device structure rendered using TracePro software.

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Figure 2. Sectional view of the unpacked micro-LED device structure.

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Figure 3. Sectional view of the packaged 5050 SMD beads.

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Figure 4. Schematic diagram of far-field light distributions of 5050 surface-mount technology (SMT) beads with Al brackets and PMMA packaging material at different inclination angles.

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Figure 5. Far-field light distributions of 5050 SMT beads with different packaging heights, Al brackets, and PMMA packaging materials at an inclination of 85°.

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Figure 6. Far-field light distributions of 5050 SMT beads with different support materials, a packaging height of 0.08 mm, and Al support at an inclination of 85°.

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Figure 7. Far-field light distributions of 5050 SMT beads with different material supports and silicone, a packaging height of 0.08 mm, and a sapphire thickness of 0.05 mm at an inclination angle of 85°.

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Figure 8. Far-field light distributions of 5050 SMT beads with different chip sizes and Al brackets, and PMMA packaging materials at an inclination angle of 85°.

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Figure 9. Far-field light distributions of 5050 SMT beads with a sapphire thickness of 30 μm Al brackets, and PMMA packaging materials at an inclination angle of 85°.

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Figure 10. Far-field light distributions of 5050 SMT beads with different sapphire thicknesses, Al brackets and PMMA packaging materials at an inclination of 85°.

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Table 1. Simulated optical parameters of different bracket materials

Material	Refractive index	Absorption Index [mm⁻¹]
Cu	1.15	65889
Al	0.7278	152263
Ag	0.886	113067
Ti	1.71	62667
Perfect absorption	-	1
Perfect reflection	1	-

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Table 2. Simulated optical parameters of different packaging materials

Material	Refractive index	Absorption index [mm⁻¹]
Epoxy	2.605	0.0078
PMMA	1.499	0
Silica	1.41	0.01

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Table 3. Simulated optical parameters of light-emitting diodes with different sizes

Material	Thickness	Refractive index	Absorption index [mm⁻¹]
Sapphire	30 µm	1.70	0.004
ITO	300 nm	1.50	0
p-GaN	150 nm	2.45	2.300
Active layer (MQW)	100 nm	2.54	25
n-GaN	6.75 µm	2.45	2.3

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Table 4. Simulated optical parameters of light-emitting diodes with different sizes

Width of square [mm]	Light-beam angle	Light extraction efficiency	Number of light beams
5	70 * 2	0.288	2
15	50 * 2	0.400	2
25	70 * 2	0.489	2
35	70 * 2	0.505	2
45	160	0.508	1
55	140	0.652	1
65	120	0.654	1
75	50 * 2	0.645	2
85	30 * 2	0.454	2

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Table 5. Far-field beam angle and output efficiency of 5050 SMT beads with Al bracket and PMMA packaging materials at different angles Table 5 . Far-field beam angles and output efficiencies of 5050 SMT beads with different packaging heights and Al brackets and PMMA packaging material at an inclination of 85°

Width of square [mm]	Light beam angle without reflection	Light extraction efficiency	Number of light beams
0.01	160	0.369	1
0.02	140	0.477	1
0.04	140	0.570	1
0.06	120	0.612	1
0.08	120	0.638	1

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Table 6. Far-field beam angles and output efficiencies of 5050 SMT beads with different packaging materials, and a packaging height of 0.08 mmm, Al brackets at an inclination of 85°.

Material	Light beam angle without reflection	Light extraction efficiency	Number of light beams
Cu	140	0.247	1
Al	20 * 2	0.574	2
Ag	20 * 2	0.615	2
Ti	160	0.194	1
Perfect absorption	120	0.175	1
Perfect reflection	30 * 2	0.813	2

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Table 7. Far-field beam angles and output efficiencies of 5050 SMT beads with different materials, a packaging height of 0.08 mm, and a sapphire thickness of 0.05 mm packaged with silicone supports at an inclination of 85°.

Width of square [mm]	Light beam angle without reflection	Light extraction efficiency	Number of light beams
Epoxy	30 * 2	0.511	2
PMMA	30 * 2	0.555	2
Silica	20 * 2	0.574	2

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Table 8. Beam angles and output efficiencies of 5050 SMT beads with different chip sizes and Al brackets and PMMA packaging materials at an inclination of 85°

Cell size	Light beam angle without reflection	Light extraction efficiency	Number of light beams
30	0.521	30*2	2
40	0.505	30*2	2
50	0.490	30*2	2
100	0.456	30*2	2

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Table 9. Beam angles and output efficiencies of 5050 SMT beads with a sapphire thickness of 30 μm, Al brackets, and PMMA packaging materials at an inclination angle of 85°

Diameter of sapphire square structure	Angle of light beam without reflection	Light extraction efficiency	Number of light beams
2	0.555	30 * 2	2
3	0.554	30 * 2	2
4	0.553	30 * 2	2

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Table 10. Beam angles and output efficiencies of 5050 SMT beads with different sapphire thicknesses and Al brackets and PMMA packaging materials at an inclination angle of 85°

Sapphire length	Light beam angle without reflection	Light extraction efficiency	Number of light beams
10	0.547	30*2	2
30	0.553	30*2	2
50	0.553	30*2	2

下载: 导出CSV

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